![]() ![]() EMI, SI and PI design issues delay product release and when uncovered after product release result in customer returns, product recalls and a loss in consumer confidence. In this post, we’ll look at highly sophisticated soft tools that can help identify PCB problem areas before manufacturing.ĭesigning high-speed, mixed-signal PCBs requires highly experienced engineering personnel and equipment resources – As such, development cost can be very high especially when multiple iterations of a board are required to achieve compliance. In a previous post, I examined the challenge of meeting electromagnetic compliance with ultrafast, power transistors like the LMG5200 half-bridge GaN switch. At these frequencies, component and printed circuit board (PCB) parasitic impedances create frequency dependent voltage drops, antenna structures and PCB resonances that in turn create electromagnetic interference (EMI), signal integrity and power integrity (SI/PI) issues. Today, gigahertz processors powered by high-frequency multi-phase DC/DC converters communicate with memory at gigahertz speeds. ![]() Other Parts Discussed in Post: LMG5200, TINA-TI ![]()
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